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by John H. Lau

Download Handbook Of Tape Automated Bonding fb2
Author: John H. Lau
ISBN: 0442004273
Language: English
Pages: 646 pages
Category: Engineering
Publisher: Springer; 1992 edition (January 31, 1992)
Rating: 4.4
Formats: azw mobi doc lrf
FB2 size: 1844 kb | EPUB size: 1300 kb | DJVU size: 1206 kb

Bibliographic Information. Handbook Of Tape Automated Bonding.

Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management and reliability. Bibliographic Information.

Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management and reliability

John H. Lau received his P.

Foreward; Preface; Acknowledgments; A brief introduction to tape automated bonding; Electrical performance of tape automated bonding . John H. Learn about new offers and get more deals by joining our newsletter.

Home John H. Lau Handbook Of Tape Automated Bonding. Bibliographic Details. Lau. Published by Springer, 1992. ISBN 10: 0442004273, ISBN 13: 9780442004279. 1. Published by Springer. ISBN 10: 0442004273 ISBN 13: 9780442004279.

HB100 Wire Bonding - Продолжительность: 1:17 TPT-Wirebonder Recommended for you.

Assembled Product Dimensions (L x W x H). 8 x . 4 x . 9 Inches.

Handbook Of Tape Automated Bonding. Coauthors & Alternates. by John H. ISBN 9780442004279 (978-0-442-00427-9) Hardcover, Springer, 1992. Find signed collectible books: 'Handbook Of Tape Automated Bonding'. Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies.

In "tape-automated bonding", thin flat metal tape leads are attached to the device pads, then welded to the printed circuit board

In "tape-automated bonding", thin flat metal tape leads are attached to the device pads, then welded to the printed circuit board. In all cases, the chip and connections are covered with an encapsulant to reduce entry of moisture or corrosive gases to the chip, and to protect the wire bonds or tape leads from physical damage. The printed circuit board substrate may be assembled into the final product, for example, as in a pocket calculator, or, in the case of a multi-chip module, the module may be inserted in a socket or otherwise attached to yet another circuit board.

John H Lau. William T. Chen. Foreward Preface Acknowledgments A brief introduction to tape automated bonding Electrical performance of tape automated bonding First-level packaging costs: tape bonding versus other high-lead package options Materials choices for tape automated bonding TAB tape design and manufacturing Wafer bumping TAB inner lead bonding TAB testing and burn-in TAB encapsulation TAB outer lead bonding Equipment selection for TAB outer lead bonding.

Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management and reliability. For professionals active in TAB research and development, those who wish to master TAB problem solving methods, and those who must choose a high-performance and cost-effective packaging technique for their interconnect systems, here's a timely summary of progress in all aspects of this fascinating field.